NOGITA, Kazuhiro: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Metallic tin recovery from wave solder dross

Henao, Hector M., Masuda, Chisato, Nogita, Kazuhiro

Journal:

International Journal of Mineral Processing

Year:

2015

Language:

english

File:

PDF, 2.22 MB

english, 2015

2

Effects of Trace Phosphorus in Sn-Cu-Ni Wave Solder Dross

Nogita, Kazuhiro, Mohd Salleh, Mohd Arif Anuar, Tran, Xuan Q., Read, Jonathan, Smith, Selena, McDonald, Stuart D.

Journal:

Materials Science Forum

Year:

2016

Language:

english

File:

PDF, 538 KB

english, 2016

3

The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review

Liu, Shiqian, McDonald, Stuart, Sweatman, Keith, Nogita, Kazuhiro

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.80 MB

english, 2018

4

The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi

Tina Ventura, Christopher M. Gourlay, Kazuhiro Nogita, Tetsuro Nishimura, Michel Rappaz, Arne K. Dahle

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 830 KB

english, 2008

5

Eutectic grain size and strontium concentration in hypoeutectic aluminium–silicon alloys

Stuart D. McDonald, Kazuhiro Nogita, Arne K. Dahle

Journal:

Journal of Alloys and Compounds

Year:

2006

Language:

english

File:

PDF, 790 KB

english, 2006

6

Development of high-temperature solders: Review

Guang Zeng, Stuart McDonald, Kazuhiro Nogita

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 3.48 MB

english, 2012

7

Eutectic Growth Mode in Strontium, Antimony and Phosphorus Modified Hypoeutectic Al-Si Foundry Alloys

Nogita, Kazuhiro, Dahle, Arne&nbsp, Kristian

Journal:

MATERIALS TRANSACTIONS

Year:

2001

File:

PDF, 6.27 MB

2001

8

In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Yamamoto, Tomokazu, Shigematsu, Koji, Aso, Kohei, Tanaka, Eishi, Matsumura, Syo, Nogita, Kazuhiro

Journal:

Journal of Power Sources

Year:

2017

Language:

english

File:

PDF, 2.64 MB

english, 2017

9

Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector

Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Hu, Yuxiang, Wang, Lianzhou, Matsumura, Syo, Nishimura, Tetsuro, Nogita, Kazuhiro

Journal:

Journal of Power Sources

Year:

2019

Language:

english

File:

PDF, 3.96 MB

english, 2019

10

The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes

Tan, Xin F., McDonald, Stuart D., Gu, Qinfen, Wang, Lianzhou, Matsumura, Syo, Nogita, Kazuhiro

Journal:

Journal of Power Sources

Year:

2019

Language:

english

File:

PDF, 3.91 MB

english, 2019

11

Nanoindentation characterization of intermetallic compounds formed between Sn–Cu (–Ni) ball grid arrays and Cu substrates

Hideaki Tsukamoto, Zhigang Dong, Han Huang, Tetsuro Nishimura, Kazuhiro Nogita

Journal:

Materials Science and Engineering: B

Year:

2009

Language:

english

File:

PDF, 1.12 MB

english, 2009

12

Eutectic nucleation in Al–Si alloys

Stuart D McDonald, Kazuhiro Nogita, Arne K Dahle

Journal:

Acta Materialia

Year:

2004

Language:

english

File:

PDF, 892 KB

english, 2004

13

Ultrahigh Electron Emissive Carbon Nanotubes with Nano-sized RuO2 Particles Deposition

Ruth Knibbe, Kazuhiro Nogita, John Drennan, Tsuneyuki Noguchi, Katsuyoshi Tatenuma, Pou Liu, Fumihito Arai, Eiji Yashima, Michiru Nishiwaki, Shigeki Kato

Journal:

Journal of Nanoparticle Research

Year:

2007

Language:

english

File:

PDF, 320 KB

english, 2007

14

Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5

Mu, Dekui, Read, Jonathan, Yang, Yafeng, Nogita, Kazuhiro

Journal:

Journal of Materials Research

Year:

2011

Language:

english

File:

PDF, 400 KB

english, 2011

15

Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface

Hideaki Tsukamoto, Tetsuro Nishimura, Kazuhiro Nogita

Journal:

Materials Letters

Year:

2009

Language:

english

File:

PDF, 705 KB

english, 2009

16

Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys

Kazuhiro Nogita, Tetsuro Nishimura

Journal:

Scripta Materialia

Year:

2008

Language:

english

File:

PDF, 848 KB

english, 2008

17

Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

Kazuhiro Nogita

Journal:

Year:

2010

Language:

english

File:

PDF, 776 KB

english, 2010

18

Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu

Dekui Mu, Hideyuki Yasuda, Han Huang, Kazuhiro Nogita

Journal:

Journal of Alloys and Compounds

Year:

2012

Language:

english

File:

PDF, 2.65 MB

english, 2012

19

Creep and Mechanical Properties of Cu6Sn5and (Cu,Ni)6Sn5at Elevated Temperatures

Dekui Mu, Han Huang, Stuart D. McDonald, Kazuhiro Nogita

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 483 KB

english, 2013

20

Influence of Composition on the Morphology of Primary Cu6Sn5in Sn-4Cu Alloys

Stuart McDonald, Kazuhiro Nogita, Jonathan Read, Tina Ventura, Tetsuro Nishimura

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 925 KB

english, 2013

21

Real time synchrotron X-ray observations of solidification in hypoeutectic Al–Si alloys

Nogita, Kazuhiro, Yasuda, Hideyuki, Prasad, Arvind, McDonald, Stuart D., Nagira, Tomoya, Nakatsuka, Noriaki, Uesugi, Kentaro, StJohn, David H.

Journal:

Materials Characterization

Year:

2013

Language:

english

File:

PDF, 1.40 MB

english, 2013

22

Solidification of Sn-0.7Cu-0.15Zn Solder:In SituObservation

Zeng, Guang, McDonald, Stuart D., Gourlay, Christopher M., Uesugi, Kentaro, Terada, Yasuko, Yasuda, Hideyuki, Nogita, Kazuhiro

Journal:

Metallurgical and Materials Transactions A

Year:

2014

Language:

english

File:

PDF, 1019 KB

english, 2014

23

Kinetics of the polymorphic phase transformation of Cu6Sn5

Zeng, Guang, McDonald, Stuart D., Read, Jonathan J., Gu, Qinfen, Nogita, Kazuhiro

Journal:

Acta Materialia

Year:

2014

Language:

english

File:

PDF, 4.98 MB

english, 2014

24

Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Suenaga, Shoichi, Zhang, Yong, Chen, Jianghua, Nogita, Kazuhiro

Journal:

Year:

2013

Language:

english

File:

PDF, 5.99 MB

english, 2013

25

Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, Nogita, Kazuhiro

Journal:

Year:

2014

Language:

english

File:

PDF, 2.96 MB

english, 2014

26

Effect of Grain Size on Microstructural Change and Damage Recovery in UO 2 Fuels Irradiated to 23 GWd/t

NOGITA, Kazuhiro, UNE, Katsumi

Journal:

Journal of Nuclear Science and Technology

Year:

1994

Language:

english

File:

PDF, 1.22 MB

english, 1994

27

Formation of Pellet-Cladding Bonding Layer in High Burnup BWR Fuels

NOGITA, Kazuhiro, UNE, Katsumi

Journal:

Journal of Nuclear Science and Technology

Year:

1997

Language:

english

File:

PDF, 1.54 MB

english, 1997

28

The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Terada, Yasuko, Uesugi, Kentaro, Yasuda, Hideyuki, Nogita, Kazuhiro

Journal:

Acta Materialia

Year:

2015

Language:

english

File:

PDF, 8.14 MB

english, 2015

29

Thermal Recovery of Radiation Defects and Microstructural Change in Irradiated UO 2 Fuels

NOGITA, Kazuhiro, UNE, Katsumi

Journal:

Journal of Nuclear Science and Technology

Year:

1993

Language:

english

File:

PDF, 1.70 MB

english, 1993

30

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics

Zeng, Guang, McDonald, Stuart D., Sweatman, Keith, Nogita, Kazuhiro

Year:

2014

Language:

english

File:

PDF, 2.70 MB

english, 2014

31

Crystallography of Zirconium Hydrides in Recrystallized Zircaloy-2 Fuel Cladding by Electron Backscatter Diffraction

UNE, Katsumi, NOGITA, Kazuhiro, ISHIMOTO, Shinji, OGATA, Keizo

Journal:

Journal of Nuclear Science and Technology

Year:

2004

Language:

english

File:

PDF, 2.08 MB

english, 2004

32

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Lead-free solders for solar and electric vehicles - Reflections on The Bridgestone World Solar Challenge 2013 in “Arrow1”

Nogita, Kazuhiro, Kennedy, James, Amsler, John, Greaves, Matthew, Tuesley, Cameron, Nishimura, Takatoshi

Year:

2014

Language:

english

File:

PDF, 394 KB

english, 2014

33

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Effect of intermetallic stabilization on the impact resistance of joints to BGA packages

Sweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro, Nishimura, Tetsuro

Year:

2009

Language:

english

File:

PDF, 1.36 MB

english, 2009

34

Electrochemical and Structural Study of Layered P2-Type Na 2/3 Ni 1/3 Mn 2/3 O 2 as Cathode Material for Sodium-Ion Battery

Wen, Yanfen, Wang, Bei, Zeng, Guang, Nogita, Kazuhiro, Ye, Delai, Wang, Lianzhou

Journal:

Chemistry – An Asian Journal

Year:

2015

Language:

english

File:

PDF, 1.01 MB

english, 2015

35

Evidence of the hydrogen release mechanism in bulk MgH2

Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro, Matsumura, Syo

Journal:

Scientific Reports

Year:

2015

Language:

english

File:

PDF, 680 KB

english, 2015

36

Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface

Tsukamoto, Hideaki, Dong, Zhi Gang, Huang, Han, Nishimura, Tetsura, Nogita, Kazuhiro

Journal:

Materials Science Forum

Year:

2010

Language:

english

File:

PDF, 690 KB

english, 2010

37

Real Time Synchrotron X-Ray Imaging for Nucleation and Growth of Cu6Sn5 in Sn-7Cu-0.05Ni High Temperature Lead-Free Solder Alloys

Nogita, Kazuhiro, Yasuda, Hideyuki, McDonald, Stuart D., Uesugi, Kentaro

Journal:

Advanced Materials Research

Year:

2012

Language:

english

File:

PDF, 324 KB

english, 2012

38

Formation and Mechanical Properties of Intermetallic Compounds in Sn-Cu High-Temperature Lead-Free Solder Joints

Mu, Dekui, Tsukamoto, Hideaki, Huang, Han, Nogita, Kazuhiro

Journal:

Materials Science Forum

Year:

2010

Language:

english

File:

PDF, 382 KB

english, 2010

39

Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni Alloys

Nogita, Kazuhiro, Ockert, Sean, Duguid, Andrew, Pierce, Jordan, Greaves, Matthew

Journal:

Materials Science Forum

Year:

2009

Language:

english

File:

PDF, 2.15 MB

english, 2009

40

Characterisation of Hydrogen Release Behaviour in Cast Mg-Ni Alloys by Synchrotron XRD and XAFS

Nogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew, McDonald, Stuart D.

Journal:

Materials Science Forum

Year:

2010

Language:

english

File:

PDF, 539 KB

english, 2010

41

Non-Metal Reinforced Lead-Free Composite Solder Fabrication Methods and its Reinforcing Effects to the Suppression of Intermetallic Formation: Short Review

Mohd Salleh, M.A.A., McDonald, Stuart, Nogita, Kazuhiro

Journal:

Applied Mechanics and Materials

Year:

2013

Language:

english

File:

PDF, 2.33 MB

english, 2013

42

A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys

Prasad, Arvind, McDonald, Stuart D., Yasuda, Hideyuki, Nogita, Kazuhiro, StJohn, David H.

Journal:

Journal of Crystal Growth

Year:

2015

Language:

english

File:

PDF, 8.71 MB

english, 2015

43

[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates

Ng, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D., Nogita, Kazuhiro

Year:

2015

Language:

english

File:

PDF, 2.98 MB

english, 2015

44

Kinetics of the β → α Transformation of Tin: Role of α-Tin Nucleation

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo, Nogita, Kazuhiro

Journal:

Crystal Growth & Design

Year:

2015

Language:

english

File:

PDF, 1.58 MB

english, 2015

45

In Situ Soldering Process Technique by Synchrotron X-Ray Imaging

Mohd Salleh, M.A.A., Sugiyama, A., Yasuda, Hideyuki, McDonald, Stuart D., Nogita, Kazuhiro

Journal:

Applied Mechanics and Materials

Year:

2015

Language:

english

File:

PDF, 399 KB

english, 2015

46

Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo, Nogita, Kazuhiro

Journal:

Journal of Materials Research

Year:

2016

Language:

english

File:

PDF, 894 KB

english, 2016

47

Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Nogita, Kazuhiro

Journal:

Journal of Materials Research

Year:

2012

Language:

english

File:

PDF, 249 KB

english, 2012

48

Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni Solders

Gourlay, C.M., Ma, Zhao Long, Xian, Jing Wei, Belyakov, Sergey A., Mohd Salleh, Mohd Arif Anuar, Zeng, Guang, Yasuda, Hideyuki, Nogita, Kazuhiro

Journal:

Materials Science Forum

Year:

2016

Language:

english

File:

PDF, 2.54 MB

english, 2016

49

The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, Salleh, M.A.A. Mohd, Nogita, Kazuhiro

Journal:

Journal of Alloys and Compounds

Year:

2016

Language:

english

File:

PDF, 5.28 MB

english, 2016

50

Understanding the Origin of Li 2 MnO 3 Activation in Li-Rich Cathode Materials for Lithium-Ion Batteries

Ye, Delai, Zeng, Guang, Nogita, Kazuhiro, Ozawa, Kiyoshi, Hankel, Marlies, Searles, Debra J., Wang, Lianzhou

Journal:

Advanced Functional Materials

Year:

2015

Language:

english

File:

PDF, 2.52 MB

english, 2015

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски